A Development Methodology for Copper End Termination Paste — Part 1: Origin of Green Defects

Copper (Cu) based pastes have emerged as the termination materials of choice for ceramic capacitors with base metal internal electrodes. To prevent oxidation of nickel (Ni) internal electrode and the copper terminations, it is necessary to fire the terminations in a nitrogen atmosphere. This require...

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Main Author:	Umesh Kumar
Format:	Article
Language:	English
Published:	Hindawi Limited 2002-01-01
Series:	Active and Passive Electronic Components
Online Access:	http://dx.doi.org/10.1080/08827510212348

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spelling	doaj-171b3c384ced45649f46e5a58005371a2020-11-25T00:59:01ZengHindawi LimitedActive and Passive Electronic Components0882-75161563-50312002-01-0125216917910.1080/08827510212348A Development Methodology for Copper End Termination Paste — Part 1: Origin of Green DefectsUmesh Kumar0Ferro Electronic Materials, 1325 Aspen Way, Vista 92083, CA, USACopper (Cu) based pastes have emerged as the termination materials of choice for ceramic capacitors with base metal internal electrodes. To prevent oxidation of nickel (Ni) internal electrode and the copper terminations, it is necessary to fire the terminations in a nitrogen atmosphere. This requirement places significant restrictions on raw material selection for the termination pastes. For example, acrylic-based resins are used as organic binder for their clean burning characteristics over the traditional ethyl cellulose based binder system. As the viscoelastic behavior of acrylic resin systems are different to those of cellulose systems, differences are observed in the flow behavior of the paste. In this paper, the influence of paste rheology on the green cosmetic defects such as mooning, peaking, etc. is discussed. Additionally, the influence of process condition such as dipping parameters, drying conditions etc., on the green cosmetic defects are discussed. Finally, properties of a copper termination, which can be processed between 800–825°C, are discussed.http://dx.doi.org/10.1080/08827510212348
collection	DOAJ
language	English
format	Article
sources	DOAJ
author	Umesh Kumar
spellingShingle	Umesh Kumar A Development Methodology for Copper End Termination Paste — Part 1: Origin of Green Defects Active and Passive Electronic Components
author_facet	Umesh Kumar
author_sort	Umesh Kumar
title	A Development Methodology for Copper End Termination Paste — Part 1: Origin of Green Defects
title_short	A Development Methodology for Copper End Termination Paste — Part 1: Origin of Green Defects
title_full	A Development Methodology for Copper End Termination Paste — Part 1: Origin of Green Defects
title_fullStr	A Development Methodology for Copper End Termination Paste — Part 1: Origin of Green Defects
title_full_unstemmed	A Development Methodology for Copper End Termination Paste — Part 1: Origin of Green Defects
title_sort	development methodology for copper end termination paste — part 1: origin of green defects
publisher	Hindawi Limited
series	Active and Passive Electronic Components
issn	0882-7516 1563-5031
publishDate	2002-01-01
description	Copper (Cu) based pastes have emerged as the termination materials of choice for ceramic capacitors with base metal internal electrodes. To prevent oxidation of nickel (Ni) internal electrode and the copper terminations, it is necessary to fire the terminations in a nitrogen atmosphere. This requirement places significant restrictions on raw material selection for the termination pastes. For example, acrylic-based resins are used as organic binder for their clean burning characteristics over the traditional ethyl cellulose based binder system. As the viscoelastic behavior of acrylic resin systems are different to those of cellulose systems, differences are observed in the flow behavior of the paste. In this paper, the influence of paste rheology on the green cosmetic defects such as mooning, peaking, etc. is discussed. Additionally, the influence of process condition such as dipping parameters, drying conditions etc., on the green cosmetic defects are discussed. Finally, properties of a copper termination, which can be processed between 800–825°C, are discussed.
url	http://dx.doi.org/10.1080/08827510212348
work_keys_str_mv	AT umeshkumar adevelopmentmethodologyforcopperendterminationpastepart1originofgreendefects AT umeshkumar developmentmethodologyforcopperendterminationpastepart1originofgreendefects
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A Development Methodology for Copper End Termination Paste — Part 1: Origin of Green Defects

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