Back Injection Molding of Sub-Micron Scale Structures on Roll-to-Roll Extrusion Coated Films

Back Injection Molding of Sub-Micron Scale Structures on Roll-to-Roll Extrusion Coated Films

Roll-to-roll extrusion coated films were bonded onto polymer parts by back injection molding (BIM). The polypropylene (PP) coated polyethylene terephthalate (PET) films were pre-patterned with microstructured V-shaped grooves with 3.2 µm and 53 µm width, and other geometries. Bonding on PET and poly...

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Bibliographic Details
Main Authors: Sijia Xie, Jerome Werder, Helmut Schift
Format: Article
Language:English
Published: MDPI AG 2021-04-01
Series:Polymers
Subjects:
printed flexible electronics
back injection molding
roll-to-roll extrusion coating
conductive nanoparticle ink
thermal bonding
Online Access:https://www.mdpi.com/2073-4360/13/9/1410
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spelling doaj-14771d5b9b6b4408b82d5c1b47ee42d72021-04-27T23:02:13ZengMDPI AGPolymers2073-43602021-04-01131410141010.3390/polym13091410Back Injection Molding of Sub-Micron Scale Structures on Roll-to-Roll Extrusion Coated FilmsSijia Xie0Jerome Werder1Helmut Schift2Laboratory for Micro- and Nanotechnology, Paul Scherrer Institute (PSI), 5232 Villigen, SwitzerlandInstitute of Polymer Nanotechnology (INKA), FHNW University of Applied Sciences and Arts Northwestern Switzerland, 5210 Windisch, SwitzerlandLaboratory for Micro- and Nanotechnology, Paul Scherrer Institute (PSI), 5232 Villigen, SwitzerlandRoll-to-roll extrusion coated films were bonded onto polymer parts by back injection molding (BIM). The polypropylene (PP) coated polyethylene terephthalate (PET) films were pre-patterned with microstructured V-shaped grooves with 3.2 µm and 53 µm width, and other geometries. Bonding on PET and poly(methyl methacrylate) (PMMA) parts was facilitated by either higher tool or melt temperatures but was particularly enhanced by applying a mild oxygen plasma to the backside of the PET film prior to injection of the polymer melt. Silver wires from conductive nanoparticle ink were embedded into the PP coating during the BIM process by controlled collapse of the V-grooves. Thus, the feasibility of combining standard carrier film materials for printed flexible electronics and packaging into a non-flat polymer part was demonstrated, which could be a helpful step towards the fabrication of polymer parts with surface functionality.https://www.mdpi.com/2073-4360/13/9/1410printed flexible electronicsback injection moldingroll-to-roll extrusion coatingconductive nanoparticle inkthermal bonding
collection DOAJ
language English
format Article
sources DOAJ
author Sijia Xie
Jerome Werder
Helmut Schift
spellingShingle Sijia Xie
Jerome Werder
Helmut Schift
Back Injection Molding of Sub-Micron Scale Structures on Roll-to-Roll Extrusion Coated Films
Polymers
printed flexible electronics
back injection molding
roll-to-roll extrusion coating
conductive nanoparticle ink
thermal bonding
author_facet Sijia Xie
Jerome Werder
Helmut Schift
author_sort Sijia Xie
title Back Injection Molding of Sub-Micron Scale Structures on Roll-to-Roll Extrusion Coated Films
title_short Back Injection Molding of Sub-Micron Scale Structures on Roll-to-Roll Extrusion Coated Films
title_full Back Injection Molding of Sub-Micron Scale Structures on Roll-to-Roll Extrusion Coated Films
title_fullStr Back Injection Molding of Sub-Micron Scale Structures on Roll-to-Roll Extrusion Coated Films
title_full_unstemmed Back Injection Molding of Sub-Micron Scale Structures on Roll-to-Roll Extrusion Coated Films
title_sort back injection molding of sub-micron scale structures on roll-to-roll extrusion coated films
publisher MDPI AG
series Polymers
issn 2073-4360
publishDate 2021-04-01
description Roll-to-roll extrusion coated films were bonded onto polymer parts by back injection molding (BIM). The polypropylene (PP) coated polyethylene terephthalate (PET) films were pre-patterned with microstructured V-shaped grooves with 3.2 µm and 53 µm width, and other geometries. Bonding on PET and poly(methyl methacrylate) (PMMA) parts was facilitated by either higher tool or melt temperatures but was particularly enhanced by applying a mild oxygen plasma to the backside of the PET film prior to injection of the polymer melt. Silver wires from conductive nanoparticle ink were embedded into the PP coating during the BIM process by controlled collapse of the V-grooves. Thus, the feasibility of combining standard carrier film materials for printed flexible electronics and packaging into a non-flat polymer part was demonstrated, which could be a helpful step towards the fabrication of polymer parts with surface functionality.
topic printed flexible electronics
back injection molding
roll-to-roll extrusion coating
conductive nanoparticle ink
thermal bonding
url https://www.mdpi.com/2073-4360/13/9/1410
work_keys_str_mv AT sijiaxie backinjectionmoldingofsubmicronscalestructuresonrolltorollextrusioncoatedfilms
AT jeromewerder backinjectionmoldingofsubmicronscalestructuresonrolltorollextrusioncoatedfilms
AT helmutschift backinjectionmoldingofsubmicronscalestructuresonrolltorollextrusioncoatedfilms
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