Effects of Bonding Treatment and Ball Milling on W-20 wt.% Cu Composite Powder for Injection Molding

• Main Authors: Mingliang Ouyang, Cuiping Wang, Huayu Zhang, Xingjun Liu
• Format: Article
• Language: English
• Published: MDPI AG 2021-04-01
• Series: Materials
• Subjects: tungsten–copper composite; bonding treatment; ball milling; powder injection molding
• Online Access: https://www.mdpi.com/1996-1944/14/8/1897

W-20 wt.% Cu pseudo-alloys were produced via powder injection molding (PIM) with powders prepared thermochemically. Bonding treatment and ball milling (BTBM) were used, and the effects of BTBM on the characteristics of the powders, rheological properties of the feedstock, shrinkage and properties of the sintered samples were studied. The morphology of the powder changed from extremely agglomerated small particles to pebble-shaped smooth large particles which were composed of several small particles combined tightly. The tap density increased from 3.25 g/cm³ to 7.22 g/cm³, and the specific surface area decreased from 0.86 m²/g to 0.45 m²/g. The critical powder loading of the feedstock increased from 45 vol.% to 56 vol.% due to the change in powder characteristics, thereby improving densification and dimension precision. For the PIM samples sintered at 1290 °C for 120 min in a hydrogen gas, the oversizing factor decreased from 1.297 to 1.216, and the dimension fluctuation ratio decreased from ±0.61% to ±0.33%. At the same time, the relative density increased from 97.8% to 98.6%, the thermal conductivity increased from 218 W/(m·K) to 233 W/(m·K), and the average coefficients of thermal expansion were roughly similar, within the range of 8.43–8.52 × 10⁻⁶/K.