A 3D Model of the Thermoelectric Microwave Power Sensor by MEMS Technology
In this paper, a novel 3D model is proposed to describe the temperature distribution of the thermoelectric microwave power sensor. In this 3D model, the heat flux density decreases from the upper surface to the lower surface of the GaAs substrate while it was supposed to be a constant in the 2D mode...
Main Authors: | Zhenxiang Yi, Xiaoping Liao |
---|---|
Format: | Article |
Language: | English |
Published: |
MDPI AG
2016-06-01
|
Series: | Sensors |
Subjects: | |
Online Access: | http://www.mdpi.com/1424-8220/16/6/921 |
Similar Items
-
DC-25 GHz and Low-Loss MEMS Thermoelectric Power Sensors with Floating Thermal Slug and Reliable Back Cavity Based on GaAs MMIC Technology
by: Zhiqiang Zhang, et al.
Published: (2018-03-01) -
n+ GaAs/AuGeNi-Au Thermocouple-Type RF MEMS Power Sensors Based on Dual Thermal Flow Paths in GaAs MMIC
by: Zhiqiang Zhang, et al.
Published: (2017-06-01) -
A Generalized Polynomial Chaos-Based Approach to Analyze the Impacts of Process Deviations on MEMS Beams
by: Lili Gao, et al.
Published: (2017-11-01) -
Optimization of the GaAs-on-Si Substrate for Microelectromechanical Systems (MEMS) Sensor Application
by: Ying Yu, et al.
Published: (2012-12-01) -
Design and Characterization of MEMS Thermal Converter
by: Jiri JAKOVENKO, et al.
Published: (2007-10-01)