Tape Automated Bonding for High Density Packaging

Bibliographic Details
Main Author:	Karel Kurzweil
Format:	Article
Language:	English
Published:	Hindawi Limited 1981-01-01
Series:	Active and Passive Electronic Components
Online Access:	http://dx.doi.org/10.1155/APEC.8.15

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spelling	doaj-121f14bb11074f278c533d9c264d89f02020-11-25T00:17:58ZengHindawi LimitedActive and Passive Electronic Components0882-75161563-50311981-01-0181-2151910.1155/APEC.8.15Tape Automated Bonding for High Density PackagingKarel Kurzweilhttp://dx.doi.org/10.1155/APEC.8.15
collection	DOAJ
language	English
format	Article
sources	DOAJ
author	Karel Kurzweil
spellingShingle	Karel Kurzweil Tape Automated Bonding for High Density Packaging Active and Passive Electronic Components
author_facet	Karel Kurzweil
author_sort	Karel Kurzweil
title	Tape Automated Bonding for High Density Packaging
title_short	Tape Automated Bonding for High Density Packaging
title_full	Tape Automated Bonding for High Density Packaging
title_fullStr	Tape Automated Bonding for High Density Packaging
title_full_unstemmed	Tape Automated Bonding for High Density Packaging
title_sort	tape automated bonding for high density packaging
publisher	Hindawi Limited
series	Active and Passive Electronic Components
issn	0882-7516 1563-5031
publishDate	1981-01-01
url	http://dx.doi.org/10.1155/APEC.8.15
work_keys_str_mv	AT karelkurzweil tapeautomatedbondingforhighdensitypackaging
_version_	1725377365699198976

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