Evaluation of Thin Copper Wire and Lead-Free Solder Joint Strength by Pullout Tests and Wire Surface Observation
Copper wires have been attracting much attention for Large Scale Integration (LSI) bonding because of their excellent mechanical and electrical properties, in addition to their low material cost. The ends of these wires are usually joined to pads or through-holes on a printed circuit board, and lead...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2017-08-01
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| Series: | Crystals |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2073-4352/7/8/255 |