Solder Joint Reliability Modeling by Sequential Artificial Neural Network for Glass Wafer Level Chip Scale Package

Solder Joint Reliability Modeling by Sequential Artificial Neural Network for Glass Wafer Level Chip Scale Package

This article combines the sequential artificial neural network (NN) machine learning with finite element (FE) modeling to assess the solder joint thermal cycling performance. A glass wafer-level chip-scale package (G-WLCSP) is used for this study. This article investigates the network structure that...

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Bibliographic Details
Main Authors: Cadmus C. A. Yuan, Chang-Chi Lee
Format: Article
Language:English
Published: IEEE 2020-01-01
Series:IEEE Access
Subjects:
Wafer level package
chip-scale package
reliability
machine learning
recurrent neural networks
long short-term memory
Online Access:https://ieeexplore.ieee.org/document/9157872/

Internet

https://ieeexplore.ieee.org/document/9157872/

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