High Temperature Epoxy Foam: Optimization of Process Parameters

• Main Authors: Samira El Gazzani, Valérie Nassiet, Jean-Pierre Habas, Christian Freydier, Aline Hilleshein
• Format: Article
• Language: English
• Published: MDPI AG 2016-06-01
• Series: Polymers
• Subjects: expandable microsphere; rigid foam; TETM trifunctional epoxy; thermomechanical analysis
• Online Access: http://www.mdpi.com/2073-4360/8/6/215

For many years, reduction of fuel consumption has been a major aim in terms of both costs and environmental concerns. One option is to reduce the weight of fuel consumers. For this purpose, the use of a lightweight material based on rigid foams is a relevant choice. This paper deals with a new high temperature epoxy expanded material as substitution of phenolic resin, classified as potentially mutagenic by European directive Reach. The optimization of thermoset foam depends on two major parameters, the reticulation process and the expansion of the foaming agent. Controlling these two phenomena can lead to a fully expanded and cured material. The rheological behavior of epoxy resin is studied and gel time is determined at various temperatures. The expansion of foaming agent is investigated by thermomechanical analysis. Results are correlated and compared with samples foamed in the same temperature conditions. The ideal foaming/gelation temperature is then determined. The second part of this research concerns the optimization of curing cycle of a high temperature trifunctional epoxy resin. A two-step curing cycle was defined by considering the influence of different curing schedules on the glass transition temperature of the material. The final foamed material has a glass transition temperature of 270 °C.