The Variations of Thermal Contact Resistance and Heat Transfer Rate of the AlN Film Compositing with PCM

• Main Authors: Huann-Ming Chou, Jin-Chi Wang, Yuh-Ping Chang
• Format: Article
• Language: English
• Published: Hindawi Limited 2015-01-01
• Series: Mathematical Problems in Engineering
• Online Access: http://dx.doi.org/10.1155/2015/174872

The electrical industries have been fast developing over the past decades. Moreover, the trend of microelements and packed division multiplex is obviously for the electrical industry. Hence, the high heat dissipative and the electrical insulating device have been popular and necessary. The thermal conduct coefficient of aluminum nitride (i.e., AlN) is many times larger than the other materials. Moreover, the green technology of composite with phase change materials (i.e., PCMs) is worked as a constant temperature cooler. Therefore, PCMs have been used frequently for saving energy and the green environment. Based on the above statements, it does show great potential in heat dissipative for the AlN film compositing with PCM. Therefore, this paper is focused on the research of thermal contact resistance and heat transfer between the AlN/PCM pairs. According to the experimental results, the heat transfer decreases and the thermal contact resistance increases under the melting process of PCM. However, the suitable parameters such as contact pressures can be used to improve the above defects.