Analytical modeling of multi-layered printed circuit board using multi-stacked via clusters as component heat spreader
In order to help the electronic designer to early determine the limits of the power dissipation of electronic component, an analytical model was established to allow a fast insight of relevant design parameters of a multi-layered electronic board constitution. The proposed steady-state a...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
VINCA Institute of Nuclear Sciences
2016-01-01
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| Series: | Thermal Science |
| Subjects: | |
| Online Access: | http://www.doiserbia.nb.rs/img/doi/0354-9836/2016/0354-98361400143M.pdf |
| Summary: | In order to help the electronic designer to early determine the limits of the
power dissipation of electronic component, an analytical model was
established to allow a fast insight of relevant design parameters of a
multi-layered electronic board constitution. The proposed steady-state
approach based on Fourier series method promotes a practical solution to
quickly investigate the potential gain of multi-layered thermal via clusters.
Generally, it has been shown a good agreement between the results obtained by
the proposed analytical model and those given by electronics cooling software
widely used in industry. Some results highlight the fact that the
conventional practices for Printed Circuit Board modeling can be dramatically
underestimate source temperatures, in particular with smaller sources.
Moreover, the analytic solution could be applied to optimize the heat
spreading in the board structure with a local modification of the effective
thermal conductivity layers. |
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| ISSN: | 0354-9836 2334-7163 |