Analytical Modeling of Metamaterial Differential Transmission Line Using Corrugated Ground Planes in High-Speed Printed Circuit Boards

Analytical Modeling of Metamaterial Differential Transmission Line Using Corrugated Ground Planes in High-Speed Printed Circuit Boards

An analytical model for metamaterial differential transmission lines (MTM-DTLs) with a corrugated ground-plane electromagnetic bandgap (CGP-EBG) structure in high-speed printed circuit boards is proposed. The proposed model aims to efficiently and accurately predict the suppression of common-mode no...

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Bibliographic Details
Main Author: Myunghoi Kim
Format: Article
Language:English
Published: MDPI AG 2019-03-01
Series:Electronics
Subjects:
common-mode noise
corrugated ground plane
differential signaling
electromagnetic bandgap
metamaterial
stepped impedance
Online Access:http://www.mdpi.com/2079-9292/8/3/299

Internet

http://www.mdpi.com/2079-9292/8/3/299

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