Thermal Stresses Analysis and Optimized TTP Processes to Achieved CNT-Based Diaphragm for Thin Panel Speakers

• Main Authors: Feng-Min Lai, Chang-Yi Peng
• Format: Article
• Language: English
• Published: Hindawi Limited 2016-01-01
• Series: Journal of Nanomaterials
• Online Access: http://dx.doi.org/10.1155/2016/8243605

Industrial companies popularly used the powder coating, classing, and thermal transfer printing (TTP) technique to avoid oxidation on the metallic surface and stiffened speaker diaphragm. This study developed a TTP technique to fabricate a carbon nanotubes (CNTs) stiffened speaker diaphragm for thin panel speaker. The self-developed TTP stiffening technique did not require a high curing temperature that decreased the mechanical property of CNTs. In addition to increasing the stiffness of diaphragm substrate, this technique alleviated the middle and high frequency attenuation associated with the smoothing sound pressure curve of thin panel speaker. The advantage of TTP technique is less harmful to the ecology, but it causes thermal residual stresses and some unstable connections between printed plates. Thus, this study used the numerical analysis software (ANSYS) to analyze the stress and thermal of work piece which have not delaminated problems in transfer interface. The Taguchi quality engineering method was applied to identify the optimal manufacturing parameters. Finally, the optimal manufacturing parameters were employed to fabricate a CNT-based diaphragm, which was then assembled onto a speaker. The result indicated that the CNT-based diaphragm improved the sound pressure curve smoothness of the speaker, which produced a minimum high frequency dip difference (ΔdB) value.