Ni-P as a New Material for Thick Film Technology

Ni-P as a New Material for Thick Film Technology

Bibliographic Details
Main Authors: A. Misiuk, B. Hołodnik, I. Barycka
Format: Article
Language:English
Published: Hindawi Limited 1981-01-01
Series:Active and Passive Electronic Components
Online Access:http://dx.doi.org/10.1155/APEC.7.221
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spelling doaj-05556847aaf9498dab90a05340dca2532020-11-24T23:37:16ZengHindawi LimitedActive and Passive Electronic Components0882-75161563-50311981-01-017422122610.1155/APEC.7.221Ni-P as a New Material for Thick Film TechnologyA. MisiukB. HołodnikI. Baryckahttp://dx.doi.org/10.1155/APEC.7.221
collection DOAJ
language English
format Article
sources DOAJ
author A. Misiuk
B. Hołodnik
I. Barycka
spellingShingle A. Misiuk
B. Hołodnik
I. Barycka
Ni-P as a New Material for Thick Film Technology
Active and Passive Electronic Components
author_facet A. Misiuk
B. Hołodnik
I. Barycka
author_sort A. Misiuk
title Ni-P as a New Material for Thick Film Technology
title_short Ni-P as a New Material for Thick Film Technology
title_full Ni-P as a New Material for Thick Film Technology
title_fullStr Ni-P as a New Material for Thick Film Technology
title_full_unstemmed Ni-P as a New Material for Thick Film Technology
title_sort ni-p as a new material for thick film technology
publisher Hindawi Limited
series Active and Passive Electronic Components
issn 0882-7516
1563-5031
publishDate 1981-01-01
url http://dx.doi.org/10.1155/APEC.7.221
work_keys_str_mv AT amisiuk nipasanewmaterialforthickfilmtechnology
AT bhoamp322odnik nipasanewmaterialforthickfilmtechnology
AT ibarycka nipasanewmaterialforthickfilmtechnology
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