Structure Inheritance in Nanoparticle Ink Direct-Writing Processes and Crack-Free Nano-Copper Interconnects Printed by a Single-Run Approach

Structure Inheritance in Nanoparticle Ink Direct-Writing Processes and Crack-Free Nano-Copper Interconnects Printed by a Single-Run Approach

When nanoparticle conductive ink is used for printing interconnects, cracks and pores are common defects that deteriorate the electrical conductivity of the printed circuits. Influences of the ink solvent, the solid fraction of the ink, the pre-printing treatment and the sintering parameters on the...

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Bibliographic Details
Main Authors: Shujie Liu, Yujie Li, Songling Xing, Lei Liu, Guisheng Zou, Peng Zhang
Format: Article
Language:English
Published: MDPI AG 2019-05-01
Series:Materials
Subjects:
nano-copper conductive ink
interconnects
structure inheritance
crack-free
direct-writing
Online Access:https://www.mdpi.com/1996-1944/12/9/1559

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