Entwicklung keramischer Vergussmassen mit Alkoxysilanen zur Steigerung der Haftfestigkeit

The adhesion of encapsulation materials is an dendrimental factor for the robustness and functionality of a power electronic device. In this work the adhesion of ceramic potting materials was developed. A new primer was invented, that enabled high shear strengths even at high temperatures for short...

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Bibliographic Details
Format: eBook
Language:German
Published: KIT Scientific Publishing 2023
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Online Access:Open Access: DOAB: description of the publication
Open Access: DOAB, download the publication
Description
Summary:The adhesion of encapsulation materials is an dendrimental factor for the robustness and functionality of a power electronic device. In this work the adhesion of ceramic potting materials was developed. A new primer was invented, that enabled high shear strengths even at high temperatures for short times. Furthermore, a completely new potting material was invented on the basis of alkoxysilanes. Especially MTES showed beneficial properties for the adhesion under temperature load.
Physical Description:1 online resource (220 p.)
ISBN:9783731512882
KSP/1000156532
Access:Open Access