Entwicklung keramischer Vergussmassen mit Alkoxysilanen zur Steigerung der Haftfestigkeit
The adhesion of encapsulation materials is an dendrimental factor for the robustness and functionality of a power electronic device. In this work the adhesion of ceramic potting materials was developed. A new primer was invented, that enabled high shear strengths even at high temperatures for short...
Format: | eBook |
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Language: | German |
Published: |
KIT Scientific Publishing
2023
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Subjects: | |
Online Access: | Open Access: DOAB: description of the publication Open Access: DOAB, download the publication |
Summary: | The adhesion of encapsulation materials is an dendrimental factor for the robustness and functionality of a power electronic device. In this work the adhesion of ceramic potting materials was developed. A new primer was invented, that enabled high shear strengths even at high temperatures for short times. Furthermore, a completely new potting material was invented on the basis of alkoxysilanes. Especially MTES showed beneficial properties for the adhesion under temperature load. |
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Physical Description: | 1 online resource (220 p.) |
ISBN: | 9783731512882 KSP/1000156532 |
Access: | Open Access |