High-Q Wafer Level Package Based on Modified Tri-Layer Anodic Bonding and High Performance Getter and Its Evaluation for Micro Resonant Pressure Sensor

by Liying Wang, Xiaohui Du, Lingyun Wang, Zhanhao Xu, Chenying Zhang, Dandan Gu
Published 2017-03-01

Research on Vibration Reduction Characteristics of Continuum and Noncontinuum System on Coupling for High-Power Gear Transmission Based on Particle Damping Materials

by Wangqiang Xiao, Zhanhao Xu, Sheng Wang, Shaowei Yu, Kai Qin, Dike Hu
Published 2021-01-01