Influence of Intermetallic Compounds on RF Resistance of Joints Soldered with Lead Free Alloys

by J. Podzemsky, V. Papez, J. Urbanek, K. Dusek
Published 2012-06-01

MEE (Materials Engineering for Electronics) - Aim, Tools and Perspectives

by J. Kousal, V. Papež, J. J. Venkrbec, J. Štětina, J. Sedláček
Published 2000-01-01