Mechanical Durability of Flexible Printed Circuit Boards Containing Thin Coverlays Fabricated with Poly(Amide-Imide-Urethane)/Epoxy Interpenetrating Networks

by Jeongah Kim, Bo-Young Kim, Seong Dae Park, Ji-Hun Seo, Chan-Jae Lee, Myong Jae Yoo, Youngmin Kim
Published 2021-08-01