The Advantages of BIM Application in EPC Mode

by Qin Hongbo
Published 2017-01-01

Effect of Bonding Temperature on Microstructure Evolution during TLP Bonding of a Ni3Al based Superalloy IC10

by Yue Xiong, Liu Fengmei, Chen Hexing, Wan Di, Qin Hongbo
Published 2018-01-01

Effect of Mixed Rare Earths on the Wetting Behavior and Interfacial Reaction between Sn-0.70Cu-0.05Ni Solder and Amorphous Fe84.3Si0.3B5.4 Alloy

by Hou Bin, Liu Fengmei, Wang Hongqin, Zhang Yupeng, Yi Jianglong, Qin Hongbo
Published 2018-01-01