Showing 1 - 2 results of 2 for search 'Ming-Chung Yip', query time: 0.03s Refine Results
  1. 1
    Characterization of Wafer-Level Packaging Materials Time-Temperature Mechanical Properties
    by Chia-Tai Kuo, 郭家泰
    Published 2004
    Other Authors: “...Ming-Chung Yip...”
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  2. 2
    Characterization of Underfill Materials Under Time-Temperature
    by Kun-Chung Chen, 陳冠中
    Published 2003
    Other Authors: “...Ming-Chung Yip...”
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