Showing 1 - 18 results of 18 for search 'Kelber, Jeffry A.', query time: 0.13s Refine Results
  1. 1
    Chemical and Electronic Structure of Aromatic/Carborane Composite Films by PECVD for Neutron Detection
    by Dong, Bin
    Published 2016
    Other Authors: “...Kelber, Jeffry A....”
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  2. 2
    The Interactions of Plasma with Low-k Dielectrics: Fundamental Damage and Protection Mechanisms
    by Behera, Swayambhu Prasad
    Published 2011
    Other Authors: “...Kelber, Jeffry A....”
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  3. 3
    Atomic Layer Deposition of H-BN(0001) on Transition Metal Substrates, and In Situ XPS Study of Carbonate Removal from Lithium Garnet Surfaces
    by Jones, Jessica C.
    Published 2020
    Other Authors: “...Kelber, Jeffry A....”
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  4. 4
    Effect of Fluorine and Hydrogen Radical Species on Modified Oxidized Ni(pt)si
    by Gaddam, Sneha Sen
    Published 2010
    Other Authors: “...Kelber, Jeffry A....”
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  5. 5
    Electrodeposition of adherent copper film on unmodified tungsten.
    by Wang, Chen
    Published 2004
    Other Authors: “...Kelber, Jeffry A....”
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  6. 6
    Passivation effects of surface iodine layer on tantalum for the electroless copper deposition.
    by Liu, Jian
    Published 2004
    Other Authors: “...Kelber, Jeffry A....”
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  7. 7
    Study of Interactions Between Diffusion Barrier Layers and Low-k Dielectric Materials for Copper/Low-k Integration
    by Tong, Jinhong
    Published 2003
    Other Authors: “...Kelber, Jeffry A....”
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  8. 8
    Cu Electrodeposition on Ru with a Chemisorbed Iodine Surface Layer.
    by Lei, Jipu
    Published 2005
    Other Authors: “...Kelber, Jeffry A....”
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  9. 9
    Direct Atomic Level Controlled Growth and Characterization of h-BN and Graphene Heterostructures on Magnetic Substrates for Spintronic Applications
    by Beatty, John D.
    Published 2016
    Other Authors: “...Kelber, Jeffry A....”
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  10. 10
    Diffusion Barriers/Adhesion Promoters. Surface and Interfacial Studies of Copper and Copper-Aluminum Alloys
    by Shepherd, Krupanand Solomon
    Published 2000
    Other Authors: “...Kelber, Jeffry A....”
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  11. 11
    Tantalum- and ruthenium-based diffusion barriers/adhesion promoters for copper/silicon dioxide and copper/low κ integration.
    by Zhao, Xiaopeng
    Published 2004
    Other Authors: “...Kelber, Jeffry A....”
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  12. 12
    Adherence/Diffusion Barrier Layers for Copper Metallization: Amorphous Carbon:Silicon Polymerized Films
    by Pritchett, Merry
    Published 2004
    Other Authors: “...Kelber, Jeffry A....”
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  13. 13
    Reactivity of Oxide Surfaces and Metal-Oxide Interfaces: Effects of Water Vapor Pressure on Ultrathin Aluminum Oxide Films, and Studies of Platinum Growth Modes on Ultrathin Oxide Films and Their Effects on Adhesion
    by Garza, Michelle
    Published 2004
    Other Authors: “...Kelber, Jeffry A....”
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  14. 14
    High-Temperature Corrosion of Aluminum Alloys: Oxide-Alloy Interactions and Sulfur Interface Chemistry
    by Addepalli, Swarnagowri
    Published 2000
    Other Authors: “...Kelber, Jeffry A....”
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  15. 15
    Adhesion/Diffusion Barrier Layers for Copper Integration: Carbon-Silicon Polymer Films and Tantalum Substrates
    by Chen, Li
    Published 1999
    Other Authors: “...Kelber, Jeffry A....”
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  16. 16
    Metal-Aluminum Oxide Interactions: Effects of Surface Hydroxylation and High Electric Field
    by Niu, Chengyu
    Published 2001
    Other Authors: “...Kelber, Jeffry A....”
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  17. 17
    Process Evaluation and Characterization of Tungsten Nitride as a Diffusion Barrier for Copper Interconnect Technology
    by Ekstrom, Bradley Mitsuharu
    Published 2005
    Other Authors: “...Kelber, Jeffry A....”
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  18. 18
    Metal Oxide Reactions in Complex Environments: High Electric Fields and Pressures above Ultrahigh Vacuum
    by Qin, Feili
    Published 2005
    Other Authors: “...Kelber, Jeffry A....”
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