Showing 1 - 15 results of 15 for search 'J. N. Aoh', query time: 0.08s Refine Results
  1. 1
    Bi-axial In-plane Residual Stress Analysis by Combining Moiré Interferometry and Hole-Drilling Method
    by YAN-JIUAN YEH, 葉炎娟
    Published 2007
    Other Authors: “...J. N. Aoh...”
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  2. 2
    Study on the Thermosonic Flip Chip Bonding of Chips with Copper Interconnect onto rigid and flex substrate
    by Qing-An Liao, 廖慶安
    Published 2007
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  3. 3
    The Effect of Mechanical Properties and Grain Characteristics of Metal Film on its Formability during Direct Nanoimprinting
    by Yu-chen Wu, 巫昱辰
    Published 2007
    Other Authors: “...J. N. Aoh...”
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  4. 4
    Finite Element Analysis on the Residual Stresses in the Laser Clad Layer Involving Phase Transformation
    by Z.S. Zhang, 張主聖
    Published 2002
    Other Authors: “...J.N. Aoh...”
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  5. 5
    Effect of Blind Hole End Geometry on the Residual Stress Analysis Using Blind Hole-drilling Method
    by Yang Shih Chen, 陳揚世
    Published 2004
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  6. 6
    The Study of Wear Characteristics of Cobalt- and Nickel- Based Clad Layer after High Temperature Thermal Fatigue
    by J.C.Chen, 陳建成
    Published 1999
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  7. 7
    Study of Hot Deformation Behavior and Microstructure of Ti-6Al-4V
    by Jou-Han Lin, 林宗翰
    Published 1999
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  8. 8
    Residual stress analysis using Moiré interferometry and hole-drilling method
    by H.M.Chen, 陳浩民
    Published 2003
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  9. 9
    Study on the Thermosonic Wire Bonding Process for Chips with Copper Intercon-nects under Inert atmosphere
    by S. F. Wu, 吳勝富
    Published 2003
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  10. 10
    Finite Element Analysis and Experimental Validation on the Laser Cladding with Pre-placed Powder
    by S. J. Liao, 廖仕傑
    Published 2003
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  11. 11
    Study on the Oxidation Wear Behavior of Laser clad Cobalt- and Nickel- Based Alloys
    by T.C. Hung, 洪宗奇
    Published 2001
    Other Authors: “...J.N. Aoh...”
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  12. 12
    Study on the Process Parameters and Bonding Interface of Thermosonic Wire Bonding for Chips with Copper Interconnects
    by R. F. Ding, 丁榮豐
    Published 2001
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  13. 13
    The Preparation of Fine Grain Gold Film and the Direct Nanoimprinting on Gold Film
    by Zhe-yu Lin, 林哲宇
    Published 2008
    Other Authors: “...J. N. AOH...”
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  14. 14
    Study on the Reliability of Thermosonic Flip Chip Bonding of Chips with Copper Interconnects on Flex Substrates
    by Wei-hao chan, 陳韋豪
    Published 2008
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  15. 15
    FEM Analysis on the Asymmetric Conditions of Steel Slab in the Sizing Press and the Subsequent Horizontal Rolling during Hot Rolling
    by Kun-lin He, 何昆霖
    Published 2008
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