Showing 1 - 10 results of 10 for search 'Hsieh, Ker-Chang', query time: 0.06s Refine Results
  1. 1
    Lead-Free Solder Ball Interface Reaction Study
    by Tzu-hao Chung, 鐘子豪
    Published 2007
    Other Authors: “...Hsieh, Ker-Chang...”
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  2. 2
    Study of High-Entropy Alloys on Hardfacing Weld
    by Wen-Tai Hsieh, 謝文泰
    Published 2007
    Other Authors: “...Hsieh, Ker-Chang...”
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  3. 3
    Wire bond and Tin Whisker study on IC package
    by jack Wang, 王新建
    Published 2002
    Other Authors: “...Hsieh, Ker-Chang...”
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  4. 4
    The brazability of Ag-(Cu,Ni)-(Ti) alloy with Aluminum Nitride
    by Tsai, Kao Tsair, 蔡高財
    Published 1995
    Other Authors: “...Hsieh, Ker Chang...”
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  5. 5
    The measurement of Ti-Zr-Cu-Ni phase diagram at 800℃
    by Shih,Chih-Hsiung, 施志雄
    Published 1995
    Other Authors: “...Hsieh, Ker-Chang...”
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  6. 6
    Wire Bond Microstructure Analysis and Void Formation Mechanism
    by Li-Chun Chan, 詹麗君
    Published 2006
    Other Authors: “...Hsieh, Ker-Chang...”
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  7. 7
    The 800℃ phase diagram of Ti-Zr-Cu-Ni alloy where Titanium more than 40 atomic percent
    by Wang, Goa-Tran, 王國川
    Published 1994
    Other Authors: “...Hsieh, Ker-chang...”
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  8. 8
    Computer Simulation And Unidirectional Solidification Of Al-Zn-Mg-Cu Alloys
    by Lee, cheng shie, 李承士
    Published 1994
    Other Authors: “...Hsieh, Ker Chang...”
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  9. 9
    The Effect of Hydrogen in Titanium Alloys Microstructure
    by Min-syong Ju, 朱民雄
    Published 2008
    Other Authors: “...Hsieh, Ker-Chang...”
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  10. 10
    The Wire Bond Reliability Steady in Transparent Molding Compound
    by Chun-Hao Chang, 張鈞豪
    Published 2008
    Other Authors: “...Hsieh, Ker-Chang...”
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