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Chung-Ju Wang
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Chung-Ju Wang
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Chung-Ju Wang
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1
Thermal Deformations and Stress Distributions of Flip-Chip BGA Package under Thermal Environment
by
Chung
-
Ju
Wang
,
王鍾儒
Published 2008
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2
Using bender elements to evaluate the shear wave velocity in dynamic centrifuge modeling test and its applocation.
by
Chung
-
Ju
Wang
,
王崇儒
Published 2010
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