Showing 1 - 20 results of 37 for search 'Chiapyng Lee', query time: 0.13s Refine Results
  1. 1
    Thermodynamic Assessment of the Au-Cu-Sn Ternary System
    Other Authors: “...Chiapyng Lee...”
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  2. 2
    Ternary Phase Diagram of Hydrogen Storage Alloys:Ti-V-Mn and Ti-Cr-Mn
    by Hung-En Lai, 賴弘恩
    Published 2007
    Other Authors: “...Chiapyng Lee...”
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  3. 3
    Growth of ZrNx Films by Reactive Sputtering and Investigation of Failure Mechanism as A Barrier Layer of Copper Metallization and Biosensors Base on Nickel Electrodes
    by sheng-wei gu, 古聖偉
    Published 2011
    Other Authors: “...Chiapyng Lee...”
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  4. 4
    Measurement of Diffusion Coefficients of Copper in TiNX Diffusion Barriers
    by Jyun-Yuan Chen, 陳俊元
    Published 2005
    Other Authors: “...Chiapyng Lee...”
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  5. 5
    The Phase Equilibria of the Au-Cu-Sn Ternary System, the Ag-Au-Cu-Sn Quaternary System, and the Interfacial Reaction between Sn-Cu Alloys and the Au Substrate
    by Hsiao Hsien-Ming, 蕭憲明
    Published 2005
    Other Authors: “...Chiapyng Lee...”
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  6. 6
    The Reliability of Lead - Free Soldering
    by Meng-Kuang Huang, 黃孟槺
    Published 2005
    Other Authors: “...Chiapyng Lee...”
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  7. 7
    The Initial and Two-Step Growth of MOCVD Copper Using (hfac)Cu(COD) as the Precursor
    by Wei-Chi Chou, 周偉吉
    Published 2002
    Other Authors: “...Chiapyng Lee...”
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  8. 8
    The Purification of (tBuN)Ta(NEt2)3 and It's Chemical Vapor Deposition of Tantalum Nitride Thin Films
    by Zong He Chen, 陳中和
    Published 2002
    Other Authors: “...Chiapyng Lee...”
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  9. 9
    Effects of Different Alloys and Printed Circuit Board Surface Finishes on the Intermetallics Growth Microstructure Mechanical Strength and Failure Analysis of Thermomechanical Fatigued Lead-free Solder Joints
    by Pei-Lin Wu, 吳沛霖
    Published 2004
    Other Authors: “...Chiapyng Lee...”
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  10. 10
    Evaluation and Comparision the Effectiveness of the (Ti,Zr)Nx and TiNx Barriers
    by Hung-Jen Yang, 楊宏仁
    Published 2004
    Other Authors: “...Chiapyng Lee...”
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  11. 11
    Investigations of Lead free Solders of Sn-Cu and Sn-Zn series in Microelectronic Packaging
    by Chien-Chung Jao, 饒建中
    Published 2006
    Other Authors: “...Chiapyng Lee...”
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  12. 12
    The Study of Phase Equilibria and Kinetics between the Sn-Sb Based Lead-free Solders and Ag/Cu Substraes
    by Chung-Yung Lin, 林忠永
    Published 2007
    Other Authors: “...Chiapyng Lee...”
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  13. 13
    Growth of Copper Seed Layer by Two-Step Metal- Organic Chemical Vapor Deposition and It‘s Applications on Cu Metallization of IC Processing
    by Hsin-Hung Lee, 李欣浤
    Published 2005
    Other Authors: “...Chiapyng Lee...”
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  14. 14
    The Study of Diffusion Barrier (Ta,Ti)Nx Thin Films
    by Chin-Hua Hsieh, 謝進華
    Published 2003
    Other Authors: “...Chiapyng Lee...”
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  15. 15
    The Study of Diffusion Barrier (Ti,Zr)Nx Thin Films
    by Bai, Wei-Chih, 白偉志
    Published 2003
    Other Authors: “...Chiapyng Lee...”
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  16. 16
    Growth of Ta-B-N Films by RF Sputtering and It''s Application on Cu Metallization of IC Processing
    by Shun-Tang Lin, 林順堂
    Published 2003
    Other Authors: “...Chiapyng Lee...”
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  17. 17
    Behavior of Chitosan Oligosacharides Addition on Amperometric Glucose Biosensor Performance
    Other Authors: “...Chiapyng Lee...”
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  18. 18
    Fabrication of a Disposable Glucose Biosensor on Screen-printed Carbon Electrodes
    by Taufik Poernomo, 葉庭善
    Published 2008
    Other Authors: “...Chiapyng Lee...”
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  19. 19
    A Study on the MOCVD Copper Films using (hfac)CuI(COD) as the Precursor
    by Gene Chen, 陳昭慶
    Published 2009
    Other Authors: “...Chiapyng Lee...”
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  20. 20
    Oxynitridation Diffusion of Arsenic in <100> Silicon
    by Chien Chung Lu, 盧建中
    Published 1996
    Other Authors: “...Chiapyng Lee...”
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