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劉立晟
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劉立晟
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劉立晟
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1
方形組件之組裝次序與加工次序之整合分析與評估
by
劉
立
晟
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2
Electromigration Test on Void Formation and Failure Mechanism of FCBGA Lead-Free Solder Joints
by
Lee-cheng Liu
,
劉
立
晟
Published 2009
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3
Flip-Chip Ball Grid Array Lead Free Solder Joint under Reliability Test
by
Lee-Cheng Liu
,
劉
立
晟
Published 2003
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