Electromigration failure mechanisms of 〈111〉 -oriented nanotwinned Cu redistribution lines with polyimide capping

by I-Hsin Tseng, Po-Ning Hsu, Tien-Lin Lu, K.N. Tu, Chih Chen
Published 2021-05-01

A solid state process to obtain high mechanical strength in Cu-to-Cu joints by surface creep on (111)-oriented nanotwins Cu

by Jing-Ye Juang, Chia-Ling Lu, Yu-Jin Li, Po-Ning Hsu, Nien-Ti Tsou, K.N. Tu, Chih Chen
Published 2021-09-01