Surface planarization of Cu and CuNiSn Micro-bumps embedded in polymer for below 20μm pitch 3DIC applications

by De Preter, Inge, Derakhshandeh, Jaber, Heylen, Nancy, Van Acker, Lut, June Rebibis, Kenneth, Miller, Andy, Beyer, Gerald, Beyne, Eric
Published 2016

SAMs (self-assembled monolayers) passivation of cobalt microbumps for 3D stacking of Si chips

by Hou, Lin, Derakhshandeh, Jaber, Armini, Silvia, Gerets, Carine, De Preter, Inge, June Rebibis, Kenneth, Miller, Andy, De wolf, Ingrid, Beyne, Eric
Published 2016